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iPhone 17 Air或成最薄机型,无实体SIM卡槽,国行版命运如何?
近日,有关iPhone 17 Air的最新爆料引起了广泛关注。据可靠消息透露,这款即将面世的苹果新机将成为苹果历史上最薄的机型,其厚度范围预计将在5mm至6mm之间。相比之下,目前苹果最薄的机型iPhone ...
腾讯网
10 分钟
苹果的超薄iPhone,没有实体SIM卡?
报道称,这款超薄iPhone目前正在富士康进行小批量试生产,并已顺利通过了proto-1阶段,进入proto-2阶段。消息人士透露,苹果工程师需要在明年夏天前解决实体SIM卡托的集成问题,才能最终确定产品设计、生产流程和设备。
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