Another advanced packaging technology for SoC is 2.5D and 3D packaging, which involves stacking chips horizontally or vertically using interposers or through-silicon vias (TSVs). Interposers are ...

President-elect Donald J. Trump has signaled he might cut funding to efforts to re-shore semiconductor manufacturing in the ...

Learn more about the $7.9 billion in direct funding awarded by the Department of Commerce to Intel through the CHIPS and ...

General Motors and LG Energy Solution have extended their 14-year battery technology partnership to include the development of prismatic cells.

The CHIPS Act award will directly support Intel’s investments at sites where the company develops and produces many of the ...

TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will ...

Glass substrates are ultra-thin, flat, transparent sheets made of high-purity silica or borosilicate glass. They serve as a ...

Intel in Rio Rancho is receiving half a billion dollars from the federal government for a massive expansion, bringing ...

In a blow to Intel's turnaround plans, CEO Pat Gelsinger has resigned from the big chip maker without a permanent successor ...

Amcor & Kolon Industries partner to pioneer more sustainable polyester materials for packaging: Zurich: Amcor, a global leader in resp ...

In a world where AI technology is enhancing every facet of our lives, PETKIT has brought the future of pet care to our homes ...