“Using 2D barcodes with atma.io and GS1 US allowed us to really communicate with our customers. It helped us engage with them ...

Presenters at the AIPIA & AWA Smart Packaging Congress discuss QR codes, NFC for pharma packaging, AI for package design, 2D ...

The global 3D semiconductor packaging market size reached USD 12.77 billion in 2024 and is projected to hit USD 57.19 billion ...

People keep coming back! designcoffers has an exceptional number of repeat buyers.

Stand out from the crowd with unique packaging designs.

Apple moves away from using TSMC's new 2nm process node for its next-gen M5 chip because of high costs, will use SoIC ...

Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.

Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, ...