With 2024 drawing to a close, the spotlight will soon be on the next-generation processes from Intel and TSMC. Both ...
TSMC is set to start mass production of semiconductors using its N2 (2nm-class) fabrication process sometime in the second ...
TSMC (TSM.US)'s Plant at Southern Taiwan Science Park May Convert Some 3nm Production Lines to 2nm: Report ...
这项建设不仅关乎产能提升,更为全球半导体产业链带来深远影响。台积电在向美国商务部提交的资料中透露,其计划在2028年最早引入2nm制程技术。在此之前,Fab21的一期工程将于2025年投产,采用4/5nm工艺进行试产。台积电将从原定的3nm工艺升级到 ...
Recent reports indicate that Intel is facing significant yield challenges with its 18A node, potentially delaying its mass ...
TSMC is reportedly in talks with NVIDIA for production of the Blackwell AI chips in its Arizona facilities starting next year ...
据TechNews报道,台积电向美国商务部提交的信息显示,最早将于2028年在美国开始生产2nm芯片。根据Fab ...
Ambition meets reality as geopolitical, technical, and logistical challenges loom analysis Over the last couple of weeks, ...
2024年11月25日,台积电(TSMC)在欧洲开放创新平台(OIP)论坛上正式宣布,备受期待的2nm制程节点已经准备就绪,所有客户都可以基于这一新技术设计相应的芯片。这一里程碑式的进展意味着,随着第二代Nanosheet晶体管技术的应用,芯片在性能和功耗方面都将迎来重大突破,预计量产时间为2025年。这一新技术的推进,不仅对半导体行业意义重大,也将对正在蓬勃发展的人工智能(AI)技术产生深远影响 ...
IT之家 11 月 24 日消息,世界最大的晶圆代工厂台积电(TSMC)本周在欧洲开放创新平台(OIP)论坛上宣布,电子设计自动化(EDA)工具和第三方 IP 模块已为台积电性能增强型的 N2P 和 N2X 制程技术(2 ...
本周全球最大的晶圆代工厂台积电(TSMC)在其欧洲开放创新平台(OIP)论坛上宣布,性能增强的N2P和N2X工艺技术的电子设计自动化(EDA)工具和第三方IP模块已经准备就绪。这意味着新品设计人员可以基于台积电第二代N2系列制程提供的工艺开发新品,从 ...
Apple moves away from using TSMC's new 2nm process node for its next-gen M5 chip because of high costs, will use SoIC ...